Transactions on Power Electronics

TPEL August 2024 cover in color
IEEE Transactions on Power Electronics

About the Publication

The IEEE Transactions on Power Electronics (TPEL) is a monthly publication where papers are available in Xplore shortly after acceptance. 

The IEEE Transactions on Power Electronics (TPEL) covers all issues in the field of power electronics, including conversion, control, applications, conceptual issues, and system integration of electric power using semiconductors and switching devices. The focus of this journal encompasses power converters including components and system integration for their applications. This journal publishes works involving techniques and methodologies on modeling and simulation, analysis, design, fabrication, testing and characterization, evaluation and validation, and applications of power-electronic components, converters, converter systems, and system integrations. Review, tutorial, and survey articles with a viewpoint on the state-of-the-art and future technological advances are also welcome.

Papers that are not within the scope of the journal may/will be summarily rejected and the authors may be suggested to submit their work to a more suitable journal. Examples include but are not limited to manuscripts focused solely on physics, theory, materials, design and/or characterization of components, systems, and applications without sufficient and demonstrated content in power electronics.

For those who are researchers in the power electronics industry or aspiring to a university career, establishing a publications portfolio is essential. Getting published in the prestigious TPEL will help elevate a career to new heights!

Interested in being an Associate Editor for TPEL? Submit the following to the TPEL Publications Adminstrator

1. A recent CV.

2.  A list of published journal papers and patents in the last 10 years.

3. At least one recommendation letter.

4. 2025 TPEL AE Application Form.

Latest Updates

Announcements

Open Calls for Papers

6.6

Impact Factor

0.07802

Eigenfactor

1.675

Article Influence Score

15.2

CiteScore
Publication Details

Further
Information

Information for Authors

Information on paper submission (e.g., correct formats, file types, etc.) can be found in TPEL’s submission guidelines. All submissions should be in a double-column format. The correct template can be found in the IEEE Template Selector. Authors should pay particular attention to documenting their work in relation to the known literature. For more information concerning tools and assistance with article preparation and submission, the proof review process, and ordering reprints, please visit the IEEE Author Center.

The articles in TPEL are peer-reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer-review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Active Content, Multimedia, and Graphic Abstracts: TPEL encourages authors to submit Active Content/Multimedia files (e.g., movies, simulation files, PowerPoints, etc.) with their papers if they believe the files will enhance the quality of the manuscript. All materials should be uploaded together at the time of submission. For more information, please read TPEL’s Active Content/Multimedia Instructions.

Institiutional Emails: Starting September 1, 2023, there will be a change in the submission requirements for TPEL. This measure is to protect our authors. It will be mandatory that all submissions have a primary email address that is institutional. Examples of institutional emails include those from an academic institution, a government agency, a company, or IEEE. Papers that do not meet this requirement will not be entered into the review process. We thank you for your assistance with this submission update.

Submit a Paper

https://mc.manuscriptcentral.com/tpel-ieee

  1. Special Section on Advanced MV Power Electronics for Grid Interactive Applications Call for Papers
  2. Special Section on Advancing Power Electronics Reliability: Components, Systems, and Intelligent Operation Call for Papers
  3. Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics
    Call for Papers page 1Call for Papers page 2

Editorial Board

Editor in Chief

Xiongfei Wang
KTH Royal Inst. of Tech. (Sweden)

Editor at Large

Yaow-Ming Chen
Natl. Taiwan Univ. (Taiwan)

Executive Editor

Maryam Saeedifard
Georgia Inst. of Tech. (USA)

Co-Editor in Chief

J. Marcos Alonso
Univ. de Oviedo (Spain)

Antonio J. Marques Cardoso
Univ. da Beira Interior (Portugal)

Brendan McGrath
RMIT Univ. (Australia)

Giovanna Oriti
Naval Postgraduate School (USA)

Xinbo Ruan
Nanjing Univ. of Aeronautics and Astronautics (China)

Dianguo Xu
Harbin Inst. of Tech. (China)

Navid Zargari
Rockwell Automation (Canada)

Editors (Letters)

Vivek Agarwal
Indian Inst. of Tech. – Bombay (India)

Xiaonan Lu
Purdue Univ. (USA)

Xinke Wu
Zhejiang Univ. (China)

Associate Editors

Jesus Acero
Univ. of Zaragoza (Spain)

Mahshid Amirabadi
Northeastern Univ. (USA)

Michael Andersen
Tech. Univ. of Denmark (Denmark)

Francisco Azcondo
Univ. of Cantabria (Spain)

Ebrahim Babaei
Univ. of Tabriz (Iran)

Andres Barrado
Univ. Carlos III de Madrid (Spain)

Kaushik Basu
Indian Inst. of Tech. – Bangalore (India)

Ali Bazzi
Univ. of Connecticut (USA)

Juergen Biela
ETH-Zurich (Switzerland)

Uimin Choi
Seoul Natl. Univ. of Sci. and Tech. (South Korea)

Hicham Chaoui
Carleton Univ. (Canada)

Ching-jan (Jim) Chen
Natl. Taiwan Univ. (Taiwan)

Ke-Horng Chen
Natl. Chiao Tung Univ. (Taiwan)

Minjie Chen
Princeton Univ. (USA)

Zhe Chen
Aalborg Univ. (Denmark)

Henry Chung
City Univ. of Hong Kong (China)

Luca Corradini
Univ. of Padova (Italy)

Francois Costa
Univ. Paris East Creteil (France)

Pooya Davari
Aalborg Univ. (Denmark)

Ali Davoudi
Univ. of Texas – Arlington (USA)

Giulio De Donato
Univ. of Rome – Sapienza (Italy)

Demercil de Souza Oliveira Júnior
Univ. de Federal do Ceará (Brazil)

Appa Rao Dekka
Lakehead Univ. (Canada)

Frans Dijkhuizen
Hitachi Energy Research (Sweden)

Christina DiMarino
Virginia Tech (USA)

Dong Dong
Virginia Tech (USA)

Maeve Duffy
Natl. Univ. of Ireland – Galway (Ireland)

Mohamed El Moursi
Khalifa Univ. of Sci. and Tech. (Iran)

Mehdi Ferdowsi
Missouri Univ. of Sci. and Tech. (USA)

BG Fernandes
India Inst. of Tech. – Bombay (India)

Cristina Fernandez
Univ. Carlos III de Madrid (Spain)

Francisco Freijedo
Huawei Tech. (Germany)

Friedrich Fuchs
Christian-Albrechts-Univ. of Kiel (Germany)

Feng Gao
Shandong Univ. (China)

Saeed Golestan
Aalborg Univ. (Denmark)

Yonghao Gui
Oak Ridge Natl. Lab. (USA)

Kosala Gunawardane
Univ. of Tech. – Sydney (Australia)

Amit Gupta
Rolls-Royce Singapore Pte. Ltd. (Singapore)

Michael Hartmann
Schneider Electric (Austria)

JiangBiao He
Univ. of Kentucky (USA)

Jinwei He
Tianjin Univ. (China)

Carl Ho
Univ. of Manitoba (Canada)

Wenkang Huang
Infineon Tech. (USA)

Shu-Yuen (Ron) Hui
Univ. of Hong Kong (China)

Jin Hur
Incheon Natl. Univ. (South Korea)

N.R.N. Idris
Univ. Tech. Malaysia (Malaysia)

Junichi Itoh
Nagaoka Univ. of Tech. (Japan)

Ho-Ching (Herbert) Iu
Univ. of Western Australia (Australia)

Lakshmi Varaha Iyer
Magna International Inc. (USA)

Seogyong Jeong
Samsung (South Korea)

Bing Ji
Univ. of Leicester (UK)

Takushi Jimichi
Toshiba Mitsubishi-Electric Industrial Systems Corp. (Japan)

Kishan Joshi
Intel Corp. (USA)

Santanu Kapat
Indian Inst. of Tech. – Kharagpur (India)

Petros Karamanakos
Tampere Univ. (Finland)

Ralph Kennel
Tech. Univ. Muenchen (Germany)

Sayed Ali Khajehoddin
Univ. of Alberta (Canada)

Georgios Konstantinou
Univ. of New South Wales (Australia)

Harish Krishnamoorthy
Univ. of Houston (USA)

Alon Kuperman
Ben-Gurion Univ. of the Negev (Israel)

Chi-Seng Lam
Univ. of Macau (China)

John Lam
York Univ. (Canada)

Byoung Kuk Lee
Sungkyunkwan Univ. (South Korea)

Chi-Kwan Lee
Univ. of Hong Kong (China)

Dong-Choon Lee
Yeungnam Univ. (South Korea)

Eun S. Lee
Hanyang Univ. (South Korea)

Kyo-Beum Lee
Ajou Univ. (South Korea)

Binbin Li
Harbin Inst. of Tech. (China)

Hong Li
Beijing Jiaotong Univ. (China)

Qiang Li
Virginia Tech (USA)

Sinan Li
Univ. of Sydney (Australia)

Yuan Li
Univ. of Pittsburgh (USA)

Zixin Li
Chinese Academy of Sci. (China)

Tsorng-Juu (Peter) Liang
Natl. Cheng-Kung Univ. (Taiwan)

Faa-Jeng Lin
Natl. Central Univ. (Taiwan)

Andreas Lindmann
Otto-von-Guericke-Univ. Magdeburg (Germany)

Marco Liserre
Christian-Albrechts-Univ. zu Kiel (Germany)

Jinjun Liu
Xi’an Jiaotong Univ. (China)

Oscar Lucia
Univ. of Zaragoza (Spain)

Dylan Dah Chuan Lu
Univ. of Tech. – Sydney (Australia)

Fang Luo
Southern Univ. of New York – Stony Brook (USA)

Ke Ma
Shanghai Jiao Tong Univ. (China)

Wilmar Martinez
KU Leuven (Belgium)

Sudip Mazumder
Univ. of Illinois – Chicago (USA)

Saad Mekhilef
Univ. of Malaysia (Malaysia)

Behrooz Mirafzal
Kansas State Univ. (USA)

Tomokazu Mishima
Kobe Univ. (Japan)

Santanu Mishra
Indian Inst. of Tech. – Kanpur (India)

Yasser Mohamed
Univ. of Alberta (Canada)

Marta Molinas
Norwegian Univ. of Sci. and Tech. (Norway)

Mohammad Monfared
Swansea Univ. (UK)

Gerry Moschopoulos
Western Univ. (Canada)

Mehdi Narimani
McMaster Univ. (Canada)

Dorin Neacsu
Tech. Univ. of Iasi (Romania)

Khai Ngo
Virginia Tech (USA)

Martin Ordonez
Univ. of British Columbia (Canada)

Sanjib Kumar Panda
Natl. Univ. of Singapore (Singapore)

Ki-Bum Park
KAIST – Daejeon (South Korea)

Dimosthenis Peftitsis
Norwegian Univ. of Sci. and Tech. (Norway)

Xiaoze Pei
Univ. of Bath (UK)

Han Peng
Huazhong Univ. of Sci. and Tech. (China)

Li Peng
Huazhong Univ. of Sci. and Tech. (China)

Mario Ponce-Silva
Natl. Center of Research and Tech. Dev. (Mexico)

Ting Qian
Virginia Tech (USA)

Dongyuan Qiu
South China Univ. of Tech. (China)

Xiaohui Qu
Southeast Univ. (China)

Tomi Roinila
Tampere Univ. (Finland)

Christian Rojas
Univ. Tech. Fed. Santa Maria – Valparaiso (Chile)

Deepak Ronanki
Indian Inst. of Tech. – Madras (India)

Alireza Safaee
Apple Inc. (USA)

Jagabar Sathik Mohamed Ali
SRM Inst. of Sci. and Tech. – Kattankulathur (India)

Giacomo Scelba
Univ. of Catania (Italy)

Mark Scott
Miami Univ. (USA)

Gab-Su Seo
Natl. Renewable Energy Lab. (USA)

Qobad Shafiee
Univ. of Kurdistan (Iran)

Bin Shao
Sillumin Semiconductor Inc. (USA)

Miaosen Shen
Lucid Motors (USA)

Kuang Sheng
Zhejiang Univ. (China)

Tingna Shi
Zhejiang Univ. (China)

Bhim Singh
Indian Inst. of Tech. – Delhi (India)

Yam Siwakoti
Univ. of Tech. – Sydney (Australia)

Mei Su
Central South Univ. (China)

Kai Sun
Tsinghua Univ. (China)

Nadia Tan Mei Lin
Univ. of Nottingham – Ningbo (China)

Yi Tang
Nanyang Tech. Univ. (Singapore)

Mohammad Tavakoli Bina
K.N. Toosi Univ. of Tech. (Iran)

Shuilin Tian
Innoscience America, Inc. (USA)

Olivier Trescases
Univ. of Toronto (Canada)

Andrzej Trzynadlowski
Univ. of Nevada (USA)

Chi (Michael) Tse
Hong Kong Polytechnic Univ. (China)

Dmitri Vinnikov
TalTech Univ. (Estonia)

Massimo Vitelli
Univ. degli Studi della Campania Luigi Vanvitelli (Italy)

Fred Wang
Univ. of Tennessee (USA)

Huai Wang
Aalborg Univ. (Denmark)

Laili Wang
Xi’an Jiaotong Univ. (China)

Mengqi (Maggie) Wang
Univ. of Michigan – Dearborn (USA)

Qiang Wei
Lakehead Univ. (Canada)

Sheldon Williamson
Univ. of Ontario Inst. of Tech. (Canada)

Yan Xing
Nanjing Univ. of Aeronautics and Astronautics (China)

Dehong (Mark) Xu
Zhejiang Univ. (China)

Wei Xu
Chinese Academy of Sci. (China)

Yaosuo (Sonny) Xue
Oak Ridge Natl. Lab. (USA)

Yingyi Yan
Analog Devices (USA)

Shih-Chin Yang
Natl. Taiwan Univ. (Taiwan)

Tao Yang
Univ. of Nottingham (UK)

Yongheng Yang
Zhejiang Univ. (China)

Amirnaser Yazdani
Ryerson Univ. (USA)

Jin Ye
Univ. of Georgia (USA)

Di Zhang
GE Global Research (USA)

Li Zhang
Leeds Univ. (UK)

Zhenbin Zhang
Shandong Univ. (China)

Zheyu Zhang
Clemson Univ. (USA)

Yuhao Zhang
Univ. of Hong Kong (China)

Ziyou Song
Univ. of Michigan (USA)

Power Electronics Letters

The IEEE Transactions on Power Electronics covers all issues of widespread or generic interest to engineers who work in the field of power electronics. The Journal editors will enforce standards and a review policy equivalent to the IEEE Transactions, and only papers of high technical quality will be accepted. Papers which treat new and novel device, circuit or system issues which are of generic interest to power electronics engineers are published. Papers which are not within the scope of this Journal will be forwarded to the appropriate IEEE Journal or Transactions editors. Examples of papers which would be more appropriately published in other Journals or Transactions include:

  1. Papers describing semiconductor or electron device physics. These papers would be more appropriate for the IEEE Transactions on Electron Devices.
  2. Papers describing applications in specific areas: e.g., industry, instrumentation, utility power systems, aerospace, industrial electronics, etc. These papers would be more appropriate for the Transactions of the Society which is concerned with these applications.
  3. Papers describing magnetic materials and magnetic device physics. These papers would be more appropriate for the IEEE Transactions on Magnetics.
  4. Papers on machine theory. These papers would be more appropriate for the IEEE Transactions on Power Systems. While original papers of significant technical content will comprise the major portion of the Journal, tutorial papers and papers of historical value are also reviewed for publication.

Awards & Recognitions

Each year, the Editors and Associate Editors of TPEL recognize first place prize papers and second place prize papers deemed best among those published in TPEL during the preceding calendar year.

For information on this award, including eligibility, criteria, award items, and past recipients, please visit the Transactions on Power Electronics (TPEL) Prize Paper Award page.

Contact Information

TPEL Editor in Chief  Xiongfei Wang.  

TPEL Letters Executive Editor Maryam Saeedifard 

TPEL Publications Administrator Mary Beth Schwartz

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